- Patent Title: Solid-state imaging apparatus and method of manufacturing the same
-
Application No.: US15944942Application Date: 2018-04-04
-
Publication No.: US10529762B2Publication Date: 2020-01-07
- Inventor: Masahiko Shimizu , Toshiaki Iwafuchi
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2011-033687 20110218
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/00
Abstract:
A solid-state imaging apparatus includes an imaging section and a substrate. The imaging section has a light-receiving portion for receiving light from an object to image the object and the imaging section is disposed on the substrate. A member is provided on the substrate in the neighborhood of the light receiving portion and the member is partially or entirely coated in black.
Public/Granted literature
- US20180226446A1 SOLID-STATE IMAGING APPARATUS AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-08-09
Information query
IPC分类:
