Invention Grant
- Patent Title: Circuit board with return path separated low crosstalk via transition structure
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Application No.: US15379994Application Date: 2016-12-15
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Publication No.: US10375822B2Publication Date: 2019-08-06
- Inventor: Yuan Li , James R. Foppiano , Jonathan P. Dowling , Gerald J. Merits , Manjunath Shivappa , Wasim I. Ullah , Claude Hilbert
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Timothy M. Honeycutt
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H05K1/02 ; H05K1/11 ; H05K3/40

Abstract:
Various circuit boards and systems are disclosed. In one aspect a system includes a circuit board and n differential signal via pairs. Each of the n differential signal via pairs has a first signal via and a second signal via and an electrical wall between the first signal via and the second signal via. There is a midline between every two adjacent differential via pairs. There are n ground return path vias. Each of the n ground return path vias is positioned substantially along one of the midlines and not on one of the electrical walls.
Public/Granted literature
- US20180177043A1 CIRCUIT BOARD WITH RETURN PATH SEPARATED LOW CROSSTALK VIA TRANSITION STRUCTURE Public/Granted day:2018-06-21
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