The invention discloses a Micro-LED mass transfer device. The mass transfer device comprises a die bonding welding arm, a flip chip bonding arm, an external physical field device and an operating table, wherein the die bonding welding arm comprises a die bonding guide rail, a die bonding bracket, a die bonding transfer head and a die bonding elastic telescopic material; and the flip chip welding arm comprises a flip chip rotary motor, a flip chip guide rail, a flip chip bracket, a flip chip transferring head and a flip chip elastic telescopic material. Correspondingly, the invention further provides a Micro-LED mass transfer method. By virtue of the Micro-LED mass transfer device and transfer method provided by the invention, the spacing of the target substrate Micro-LED is only determinedby the transfer head template spacing is overcome in an innovative mode, the rigid structure between the original transfer heads is replaced by the elastic telescopic materials, and the longitudinaldeformation of the elastic telescopic material is changed through the external physical field, so that complete controllable mass transfer of the distance of the electronic elements is realized.