The disclosure relates to a manufacture method of a flexible integrated packaging system, comprising: making multiple extensible wires and multiple ports connected with the multiple extensible wires on a flexible substrate by photoetching; transferring multiple chips with different functions under integration to the flexible substrate; connecting the chips with different functions to the extensible wires via bonding wires; connecting a flexible packaging material to the flexible substrate to form the flexible integrated packaging system, wherein the flexible substrate is provided with a plurality of non-through first holes, and the flexible substrate and the flexible packaging material are made of flexible material. The manufacture method provided according to an embodiment of the disclosure employs a manufacture process of integrating prior to packaging; the manufacture method is simple; the manufactured flexible integrated packaging system has good integrity, high transmission efficiency, low power consumption, good flexibility, good heat-dissipating performance and good applicability.