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1.发明申请公开(公告)号：US20200073195A1
公开(公告)日：2020-03-05
申请号：US16554464
申请日：2019-08-28
Applicant: OE Solutions Co., Ltd.
Inventor： Moon Soo PARK , Tae Young JEON
IPC: G02F1/225 , G02F1/035 , H04B10/548 , H04B10/516 , H04B10/40
Abstract: An optical transceiver including a submount, a Mach-Zehnder Modulator (MZM), bonding wires, and a low pass filter type matching network is provided. The MZM includes an input port and an output port and disposed on the submount. The bonding wires are coupled to the submount and the MZM. The low pass filter type matching network is coupled to the bonding wires and is configured to absorb inductance of the bonding wires at a high frequency.
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2.发明申请公开(公告)号：US20180302155A1
公开(公告)日：2018-10-18
申请号：US16005551
申请日：2018-06-11
Applicant: OE Solutions America, Inc.
Inventor： Jong Ho KIM , Wanseok SEO , Soonwon HONG , Moon Soo PARK
IPC: H04B10/079 , H04B10/077 , H04L1/00
CPC classification number: H04B10/0795 , H04B10/0773 , H04B10/0775 , H04L1/0033 , H04L1/0036 , H04L1/0057
Abstract: Methods and apparatuses for optical communications are provided. By way of example, an optical transceiver includes a processing device coupled to a memory, an optical subassembly, and a programmable device. The optical subassembly is configured to receive and modulate a first signal carrying high speed user data for transmission to a remote device over an optical link. The programmable device is coupled to the processing device and configured to receive data relating to digital diagnostic monitoring information (DDMI) of the optical transceiver from the processing device, perform forward error correction encoding on the DDMI data to produce a remote digital diagnostic monitoring (RDDM) signal, and send the RDDM signal to the optical subassembly as a second signal to modulate for transmission. The optical subassembly is configured to current modulate the second signal on the first signal to produce a double modulated optical signal for transmission to the remote device.
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公开(公告)号：US10044468B2
公开(公告)日：2018-08-07
申请号：US15171980
申请日：2016-06-02
Applicant: OE Solutions America, Inc.
Inventor： Wanseok Seo , Jong Ho Kim , Moon Soo Park , Joon Sang Yu
Abstract: Disclosed is an optical transceiver. The optical transceiver includes a decoder for decoding an 8B10B line-coded signal, a data mapper for separating the decoded signal into block units and securing extra memory capacity by mapping a data code and a block information code onto each of the separated blocks, and an FEC encoding unit for creating Forward Error Correction (FEC) data and mapping the FEC data onto the extra memory capacity.
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公开(公告)号：US09749062B2
公开(公告)日：2017-08-29
申请号：US15245176
申请日：2016-08-24
Applicant: OE SOLUTIONS AMERICA, INC.
Inventor： Wan Seok Seo , Bong Sin Kwark , Moon Soo Park
CPC classification number: H04B10/6971 , H03F3/087 , H04B10/6911 , H04B10/6932
Abstract: A high-speed optical receiver implemented using a low-speed light receiving element is provided, which is configured to receive an optical signal having a higher transmission rate than that received using a general avalanche photo diode (APD) by expanding a frequency bandwidth using a receiver circuit configured together with an APD in the optical receiver including the APD, an APD bias control circuit, a transimpedance amplifier (TIA) for amplifying a signal received from the APD to have low noise, and a post amplifier; and a method of implementing such a high-speed optical receiver.
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公开(公告)号：US09722705B2
公开(公告)日：2017-08-01
申请号：US14947905
申请日：2015-11-20
Applicant: OE SOLUTIONS AMERICA, INC.
Inventor： Daniel J. Blumenthal , Holger Klein , Todd Cicchi , Patrick Bybee , Henrik Poulsen
IPC: H04B10/00 , H04B10/50 , H04B10/572 , H01S5/0687 , H01S5/00
CPC classification number: H04B10/5057 , H01S5/005 , H01S5/0085 , H01S5/0687 , H04B10/503 , H04B10/572
Abstract: An apparatus for controlling, monitoring, and communicating with an optical device, photonic integrated circuit or subassembly is provided. The apparatus includes an optical device or subassembly; and afield programmable device including programmable hardware gates coupled to the optical device or subassembly. The field programmable device may be configured to implement a plurality of functions at a gate level for controlling, monitoring, and/or communicating with the optical device or subassembly, each of the plurality of functions being configured to execute as a concurrent process, without use of a microprocessor or a microcontroller. Further, a programmable optical device, such as a programmable optical transmitter, optical subassembly, or transceiver based on a tunable laser having field programmable device centric control systems with software-enabled features offer extensive real-time control and monitoring functionality based on for example actual traffic flows.
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Patent Agency Ranking
公开(公告)号：US09509409B2
公开(公告)日：2016-11-29
申请号：US14558383
申请日：2014-12-02
Applicant: OE Solutions America, Inc.
Inventor： Wanseok Seo , Jong Ho Kim , Moon Soo Park , Joon Sang Yu
CPC classification number: H04B10/40 , H04J14/0224
Abstract: Disclosed is an optical transceiver which includes an optical transmitter converting a first electrical signal into a first optical signal, an optical receiver converting a second optical signal into a second electrical signal, and a processing unit operatively coupled to the optical transmitter and the optical receiver. The processing unit is configured to obtain first wavelength information of the first optical signal and second wavelength information of the second optical signal and compare the first wavelength information and the second wavelength information to control a wavelength separation interval between the first optical signal and the second optical signal.
Abstract translation: 公开了一种光收发器，其包括将第一电信号转换为第一光信号的光发射机，将第二光信号转换为第二电信号的光接收机，以及可操作地耦合到光发射机和光接收机的处理单元。 处理单元被配置为获得第一光信号的第一波长信息和第二光信号的第二波长信息，并比较第一波长信息和第二波长信息，以控制第一光信号和第二光信号之间的波长间隔 信号。
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7.发明申请SYSTEM AND METHOD FOR REDUCED POWER CONSUMPTION AND HEAT REMOVAL IN OPTICAL AND OPTOELECTRONIC DEVICES AND SUBASSEMBLIES 有权用于光电和光电器件和基座的降低功耗和散热的系统和方法公开(公告)号：US20160269119A1
公开(公告)日：2016-09-15
申请号：US15164313
申请日：2016-05-25
Applicant: OE Solutions America, Inc.
Inventor： Daniel Jacob BLUMENTHAL
CPC classification number: H04B10/40 , G02B6/4271 , H01S3/0401 , H01S3/0405 , H01S5/02284 , H01S5/02407 , H01S5/02415 , H01S5/02438 , H01S5/02469 , H04B10/503 , H05K7/20336
Abstract: A heat removal system for use in optical and optoelectronic devices and subassemblies is provided. The heat removal system lowers the power consumption of one or more active cooling components within the device or subassembly, such as a TEC, which is used to remove heat from heat generating components within the device or subassembly. For any particular application, the heat removal system more efficiently removes the heat from the active cooling component, by using a heat transfer assembly, such as a planar heat pipe type assembly. The heat transfer assembly employs properties like, but not limited to, phase transition change and thermal conductivity to move heat without external power. In some embodiments, the heat transfer assembly can be used to allow the active cooling component, such as a TEC to be removed, leaving the heat transfer assembly to remove the heat from the device or subassembly.
Abstract translation: 提供了用于光学和光电子器件和子组件的散热系统。 除热系统降低了装置或子组件内的一个或多个主动冷却部件的功率消耗，例如TEC，其用于从装置或子组件内的发热部件移除热量。 对于任何特定应用，散热系统通过使用诸如平面热管式组件的传热组件更有效地去除主动冷却部件的热量。 传热组件采用但不限于相变过程和热传导性，以在没有外部功率的情况下移动热量。 在一些实施例中，热传递组件可用于允许主动冷却部件，例如TEC被移除，离开传热组件以从装置或子组件移除热量。
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公开(公告)号：US09438355B2
公开(公告)日：2016-09-06
申请号：US13942519
申请日：2013-07-15
Applicant: OE SOLUTIONS AMERICA, INC.
Inventor： Daniel Jacob Blumenthal , Henrik N. Poulsen
IPC: H04B10/40 , H04B10/80 , H04B10/079 , H04Q11/00
CPC classification number: H04B10/801 , H04B10/0793 , H04B10/40 , H04Q11/0066 , H04Q2011/0083
Abstract: The present invention describes systems 1, 12 and methods for control of optical devices and communications subsystems. The control system comprises ASIC sub-modules and programmable circuitry 25 which may be integrated into a self-contained, stand-alone module. In one embodiment, the module has one or more FPGAs 25 in conjunction with RF and Digital ASICs 30, an integrated cross-connect 36 between the FPGA and digital and RF ASIC building blocks, and an integrated cross-connect 41 between the ASIC and optical circuits and supporting functions. Programmable chip control and other transmission and tuning functions, programmable transponders, and each FPGA/ASIC 25, 30 that is incorporated into a transponder form factor or a host board, can have the same or different functionalities and other parameters including but not limited to modulation format.
Abstract translation: 本发明描述了系统1,2以及用于控制光学设备和通信子系统的方法。 控制系统包括ASIC子模块和可编程电路25，其可以集成到独立的独立模块中。 在一个实施例中，该模块具有与RF和数字ASIC 30一起的一个或多个FPGA 25，FPGA与数字和RF ASIC构建块之间的集成交叉连接36以及ASIC和光学器件之间的集成交叉连接41 电路和配套功能。 可编程芯片控制和其他传输和调谐功能，可编程转发器以及并入应答器外形尺寸或主机板的每个FPGA / ASIC 25,30可以具有相同或不同的功能和其他参数，包括但不限于调制 格式。
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9.发明授权System and methods for reduced power consumption and heat removal in optical and optoelectronic devices and subassemblies 有权用于光学和光电器件和子组件中降低功耗和散热的系统和方法公开(公告)号：US09370123B2
公开(公告)日：2016-06-14
申请号：US13866784
申请日：2013-04-19
Applicant: Packet Photonics, Inc.
Inventor： Daniel Jacob Blumenthal
CPC classification number: H04B10/40 , G02B6/4271 , H01S3/0401 , H01S3/0405 , H01S5/02284 , H01S5/02407 , H01S5/02415 , H01S5/02438 , H01S5/02469 , H04B10/503 , H05K7/20336
Abstract: A heat removal system for use in optical and optoelectronic devices and subassemblies is provided. The heat removal system lowers the power consumption of one or more active cooling components within the device or subassembly, such as a TEC, which is used to remove heat from heat generating components within the device or subassembly. For any particular application, the heat removal system more efficiently removes the heat from the active cooling component, by using a heat transfer assembly, such as a planar heat pipe type assembly. The heat transfer assembly employs properties like, but not limited to, phase transition change and thermal conductivity to move heat without external power. In some embodiments, the heat transfer assembly can be used to allow the active cooling component, such as a TEC to be removed, leaving the heat transfer assembly to remove the heat from the device or subassembly.
Abstract translation: 提供了用于光学和光电子器件和子组件的散热系统。 除热系统降低了装置或子组件内的一个或多个主动冷却部件的功率消耗，例如TEC，其用于从装置或子组件内的发热部件移除热量。 对于任何特定应用，散热系统通过使用诸如平面热管式组件的传热组件更有效地去除主动冷却部件的热量。 传热组件采用但不限于相变过程和热传导性，以在没有外部功率的情况下移动热量。 在一些实施例中，热传递组件可用于允许主动冷却部件，例如TEC被移除，离开传热组件以从装置或子组件移除热量。
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公开(公告)号：US20200076510A1
公开(公告)日：2020-03-05
申请号：US16554499
申请日：2019-08-28
Applicant: OE Solutions Co., Ltd.
Inventor： Moon Soo PARK , Tae Young JEON
Abstract: A transmitter optical sub-assembly (TOSA) with low group delay (GD) performance over an operating frequency range of the TOSA is designed based on a synthesis of low pass filters. The low pass filters include a first stage low pass filter (LPF1) and a second stage low pass filter (LPF2) coupled to the LPF1 in a cascade form and a load impedance. The LPF1 and the LPF2 are configured to include inductance of stray components in the TOSA.
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