公开(公告)号：US10014195B2

公开(公告)日：2018-07-03

申请号：US15661330

申请日：2017-07-27

Applicant: Kirk Alan Martin

Inventor： Kirk Alan Martin

IPC: H01L21/302 ,  H01L21/67 ,  H01L21/311 ,  H01L21/50

CPC classification number: H01L21/67126 ,  H01L21/31111 ,  H01L21/50 ,  H01L21/67075 ,  H01L21/6708

Abstract: A decapsulation apparatus has an etch plate, an off-center etch head having an opening, a cover sealing to the etch plate forming an etching chamber, a gasket surrounding the opening, a ram sealed through the cover, a pressure-controlled source of Nitrogen or inert gas continuously purging the etching chamber at a low gas pressure, a f toggle mechanism mounted to a metal plate t, an etchant supply subsystem comprising sources of etchant solutions, an etchant solution pump, supply passages and controls to select etchants and etchant ratios, and a heat exchanger heating or cooling the etchant solution, etchant waste passages f conducting used etchant away. Etchants are mixed in the passages to the reaction region, and turbulence in the reaction region is promoted by impinging etchant solution on the encapsulated device.

公开(公告)号：US09991142B2

公开(公告)日：2018-06-05

申请号：US14726880

申请日：2015-06-01

Applicant: Kirk Alan Martin

Inventor： Kirk Alan Martin

IPC: H01L21/306 ,  H01L21/67 ,  H01L21/3213 ,  H01L21/56

CPC classification number: H01L21/67126 ,  H01L21/32134 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system for decapsulating a portion of an encapsulated integrated circuit that includes copper elements has one or more containers holding specific etchant solutions, a pump having an inlet port connected to the one or more containers holding specific etchant solutions, and an outlet port, a temperature-controlled metal block having a fluid inlet connected to the pump outlet port, and an outlet port from the block, and control circuitry enabling control of temperature of the metal block and operation of the pump, and flow and temperature sensors coupled to the control circuitry. Etchant temperature at the outlet of the metal block is controlled to be at or below ambient temperature by controlling the pump and temperature of the metal block, and etchant mixture is delivered via a delivery conduit to an encapsulation surface of an encapsulated integrated circuit, decapsulating a portion of encapsulated circuit, minimizing damage to the copper elements.

公开(公告)号：US10679876B2

公开(公告)日：2020-06-09

申请号：US15997373

申请日：2018-06-04

Applicant: Kirk Alan Martin

Inventor： Kirk Alan Martin

IPC: H01L21/67 ,  H01L21/3213 ,  H01L21/56

Abstract: A system for decapsulating a portion of an encapsulated integrated circuit that includes copper elements has a container holding an etchant solution, a pump having an inlet port connected to the container holding an etchant solution, and an outlet port, a heat exchanger having an inlet port connected to the pump outlet port, and an outlet port from the heat exchanger, and control circuitry controlling temperature of the etchant to be at or below ambient temperature by controlling temperature of the heat exchanger.

公开(公告)号：US09059184B2

公开(公告)日：2015-06-16

申请号：US13329735

申请日：2011-12-19

Applicant: Kirk Alan Martin

Inventor： Kirk Alan Martin

IPC: H01L21/302 ,  H01L21/56 ,  H01L21/3213 ,  H01L21/67

CPC classification number: H01L21/67126 ,  H01L21/32134 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and system for decapsulating a portion of an encapsulated integrated circuit delivers etchant mixture in variable but precise, high-velocity micro-metered pulses to a single outlet port of a pump from any one of or a combination of separate inlet ports connected to separate etchant source containers holding specific etchant solutions, controls temperature of the etchant mixture by passing the etchant mixture from the outlet port through a serpentine passage in a temperature-controlled metal block, and delivers the etchant mixture from the serpentine passage of the temperature-controlled block via a delivery conduit to an encapsulation surface of the encapsulated integrated circuit.

Abstract translation: 用于将封装的集成电路的一部分解封的方法和系统以可变但精确的高速微计量脉冲将蚀刻剂混合物从泵的单个出口端口中的任一个或组合分离出来 含有特定蚀刻剂溶液的蚀刻剂源容器，通过将蚀刻剂混合物从出口通过温度控制的金属块中的蛇形通道控制蚀刻剂混合物的温度，并将温度控制块的蛇形通道的蚀刻剂混合物输送 通过输送管道到封装的集成电路的封装表面。

公开(公告)号：US10510568B2

公开(公告)日：2019-12-17

申请号：US14887726

申请日：2015-10-20

Applicant: Kirk Alan Martin

Inventor： Kirk Alan Martin

IPC: C23F11/04 ,  H01L21/67

Abstract: An inhibitor solution injector system for an IC decapsulation apparatus has a source reservoir of inhibitor solution, a fluid injection apparatus connected to the source reservoir by a fluid passage, an injection coupling having a first input passage for inhibitor solution, and a through passage for etchant solution, the input passage intersecting with the through passage, and control circuitry controlling the controlled fluid injection apparatus. The fluid injection apparatus is controlled to draw inhibitor solution from the source reservoir, and to inject inhibitor solution through the input passage into the through passage of the injection coupling.

公开(公告)号：US09721816B2

公开(公告)日：2017-08-01

申请号：US14887832

申请日：2015-10-20

Applicant: Kirk Alan Martin

Inventor： Kirk Alan Martin

IPC: C23F1/00 ,  H01L21/67 ,  H01L21/311

CPC classification number: H01L21/67126 ,  H01L21/31111 ,  H01L21/50 ,  H01L21/67075 ,  H01L21/6708

Abstract: A decapsulation apparatus has an etch plate, an off-center etch head having an opening, a cover sealing to the etch plate forming an etching chamber, a gasket surrounding the opening, a ram sealed through the cover, a pressure-controlled source of Nitrogen or inert gas continuously purging the etching chamber at a low gas pressure, a f toggle mechanism mounted to a metal plate t, an etchant supply subsystem comprising sources of etchant solutions, an etchant solution pump, supply passages and controls to select etchants and etchant ratios, and a heat exchanger heating or cooling the etchant solution, etchant waste passages f conducting used etchant away. Etchants are mixed in the passages to the reaction region, and turbulence in the reaction region is promoted by impinging etchant solution on the encapsulated device.