-
公开(公告)号：US12288980B2
公开(公告)日：2025-04-29
申请号：US17965301
申请日：2022-10-13
Applicant: Polytronics Technology Corp.
Inventor： Yi-Hsuan Lee , Pin Hsuan Li , Yi-An Sha
Abstract: An over-current protection device includes a resistor element, an outer electrode, and an encapsulation layer. The resistor element has a first insulation layer, a first electrically conductive layer, a PTC material layer, a second electrically conductive layer and a second insulation layer stacked sequentially from bottom to top. The first insulation layer has a bottom surface and a first sidewall adjoining the bottom surface. The outer electrode has a first electrode and a second electrode disposed on the bottom surface. The first and second electrodes are electrically connected to the first conductive layer through the first and second vias, respectively. The encapsulation layer covers the first sidewall of the first insulation layer and extends to a part of the bottom surface, thereby forming a first perimeter on the bottom surface of the first insulation layer. The first and second electrodes are located inside the first perimeter.
-
公开(公告)号：US20250095887A1
公开(公告)日：2025-03-20
申请号：US18636873
申请日：2024-04-16
Applicant: Polytronics Technology Corp.
Inventor： CHENG-YU TUNG , Chia-Yuan Lee , HSIU-CHE YEN , CHINGTING CHIU , CHEN-NAN LIU , YUNG-HSIEN CHANG , Yao-Te Chang , FU-HUA CHU
Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a fluoropolymer. The fluoropolymer has a plurality of spherulites, and the fractal dimension of each spherulite is lower than 12.
-
公开(公告)号：US20250030236A1
公开(公告)日：2025-01-23
申请号：US18390734
申请日：2023-12-20
Applicant: Polytronics Technology Corp.
Inventor： Hsiu-Che YEN , Chingting CHIU , Chia-Yuan LEE , Chen-Nan LIU , Cheng-Yu TUNG , Yung-Hsien CHANG , Yao-Te CHANG , Fu-Hua CHU
Abstract: An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer and a second fluoropolymer. The weight average molecular weight of the second fluoropolymer ranges from 630000 g/mol to 1100000 g/mol. The conductive filler is dispersed in the polymer matrix, thereby forming an electrically conductive path in the heat-sensitive layer.
-
公开(公告)号：US20240145133A1
公开(公告)日：2024-05-02
申请号：US18295919
申请日：2023-04-05
Applicant: Polytronics Technology Corp.
Inventor： CHEN-NAN LIU , YUNG-HSIEN CHANG , CHENG-YU TUNG , HSIU-CHE YEN , Chia-Yuan LEE , Yao-Te CHANG , FU-HUA CHU
Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.
-
公开(公告)号：US20240127988A1
公开(公告)日：2024-04-18
申请号：US18177681
申请日：2023-03-02
Applicant: Polytronics Technology Corp.
Inventor： HSIU-CHE YEN , YUNG-HSIEN CHANG , CHENG-YU TUNG , Chia-Yuan Lee , CHEN-NAN LIU , Yao-Te Chang , FU-HUA CHU
IPC: H01C7/02
Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as α-PVDF, β-PVDF and γ-PVDF. The total amount of α-PVDF, β-PVDF and γ-PVDF is calculated as 100%, and the amount of α-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.
-
Patent Agency Ranking
公开(公告)号：US20240071656A1
公开(公告)日：2024-02-29
申请号：US18154599
申请日：2023-01-13
Applicant: Polytronics Technology Corp.
Inventor： Chien Hui WU , Yung-Hsien CHANG , Cheng-Yu TUNG , Ming-Hsun LU , Yi-An SHA
CPC classification number: H01C7/021 , H01C1/01 , H01C1/1406
Abstract: A circuit protection device includes a first temperature sensitive resistor, a second temperature sensitive resistor, an electrically insulating multilayer, a first and second electrode layer, and at least one external electrode. The first temperature sensitive resistor and the second temperature sensitive resistor are electrically connected in parallel, and have a first upper electrically conductive layer and a second lower electrically conductive layer, respectively. The electrically insulating multilayer includes an upper insulating layer, a middle insulating layer, and a lower insulating layer. The upper insulating layer is between the first upper electrically conductive layer and the first electrode layer. The middle layer is laminated between the first temperature sensitive resistor and the second temperature sensitive resistor. The lower insulating layer is between the second lower electrically conductive layer and the second electrode layer. The external electrode is disposed on the first electrode layer, and extends beyond a peripheral wall along a horizontal direction.
-
公开(公告)号：US11626220B2
公开(公告)日：2023-04-11
申请号：US17471795
申请日：2021-09-10
Applicant: Polytronics Technology Corp.
Inventor： Feng Ji Li , Yi-Hsuan Lee , Yung Hsien Chang
Abstract: A surface-mountable over-current protection device comprises at least one PTC material layer, a first conductive layer, a second conductive layer, a first electrode, a second electrode, an insulating layer, and a cover layer. The PTC material layer comprises crystalline polymer and conductive fillers dispersed therein. The first conductive layer and the second conductive layer are disposed on a first surface and a second surface of the PTC material layer, respectively. The first electrode and the second electrode are electrically connected to the first conductive layer and the second conductive layer, respectively. The insulating layer is disposed between the first electrode and the second electrode for insulation. The cover layer includes a fluorine-containing polymer, and wraps around an entire outer surface of the surface-mountable over-current protection device.
-
公开(公告)号：US20220201856A1
公开(公告)日：2022-06-23
申请号：US17188528
申请日：2021-03-01
Applicant: Polytronics Technology Corp.
Inventor： KUO HSUN CHEN , Cheng Tsung Yang , Feng-Chun Yu , KAI-WEI LO
IPC: H05K1/05 , H01L23/373
Abstract: A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.
-
公开(公告)号：US11018502B2
公开(公告)日：2021-05-25
申请号：US16290279
申请日：2019-03-01
Applicant: Polytronics Technology Corp.
Inventor： Zhen Yu Dong , Yung Hsien Chang , Hsiu Che Yen , Yao Te Chang , Pin Syuan Li
Abstract: A cable comprises a power conductor, a data conductor and a first PTC device. The power conductor is configured to transmit electrical power between a source and a sink. The data conductor is configured to transmit data between the source and the sink. The first PTC device is coupled to the data conductor and its resistance increases drastically to decrease current flowing through the data conductor if a temperature of the first PTC device exceeds a first trip temperature. The first trip temperature is 55-80° C. The resistance of the PTC device is larger than 20 kΩ at 85° C. and larger than 80 kΩ at 100° C. A current flowing through the data conductor does not exceed 20 mA.
-
公开(公告)号：US20210059056A1
公开(公告)日：2021-02-25
申请号：US16844566
申请日：2020-04-09
Applicant: Polytronics Technology Corp.
Inventor： Kuo-Hsun CHEN , Chia-Hsiung Wu , Kai-Wei LO , Yu-Hsuan Tseng
Abstract: A thermally conductive board comprises a metal substrate, a foil containing copper, a thermally conductive and insulating layer and a barrier layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate. The barrier layer is laminated between the foil containing copper and the thermally conductive and electrically insulating layer. The barrier is in direct contact with the foil containing copper, and the interface between the barrier layer and the foil containing copper comprises a microrough surface. The barrier layer has a Redox potential between 0 and −1V. The microrough surface has a roughness Rz of 2-18 μm.
-
-
-
-
-
-
-
-
-
Search Results
139
records
(took 0.022 seconds)
