-
公开(公告)号：CN107210237A
公开(公告)日：2017-09-26
申请号：CN201580074691.2
申请日：2015-12-08
Applicant: 半导体元件工业有限责任公司
IPC: H01L21/60 , H01L21/683 , H01L23/482
CPC classification number: H01L24/32 , H01L21/4825 , H01L21/6836 , H01L21/78 , H01L23/482 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/30 , H01L24/31 , H01L24/33 , H01L24/81 , H01L24/83 , H01L24/94 , H01L2221/68327 , H01L2221/68381 , H01L2224/03416 , H01L2224/03418 , H01L2224/03444 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/0347 , H01L2224/0348 , H01L2224/0401 , H01L2224/04026 , H01L2224/05075 , H01L2224/05082 , H01L2224/05083 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05639 , H01L2224/05647 , H01L2224/11462 , H01L2224/11464 , H01L2224/11849 , H01L2224/1308 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/13166 , H01L2224/13171 , H01L2224/16227 , H01L2224/16503 , H01L2224/16507 , H01L2224/17106 , H01L2224/2908 , H01L2224/29082 , H01L2224/29083 , H01L2224/29111 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/29166 , H01L2224/29171 , H01L2224/29565 , H01L2224/29582 , H01L2224/29655 , H01L2224/29666 , H01L2224/3003 , H01L2224/30505 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/81439 , H01L2224/8181 , H01L2224/81815 , H01L2224/81825 , H01L2224/83439 , H01L2224/8381 , H01L2224/83815 , H01L2224/83825 , H01L2224/8481 , H01L2224/8581 , H01L2224/8681 , H01L2224/94 , H01L2924/00015 , H01L2924/01327 , H01L2924/10162 , H01L2924/12041 , H01L2224/03 , H01L2224/27 , H01L2924/00014 , H01L2924/00012 , H01L2924/01074 , H01L2924/01024 , H01L2924/20642 , H01L2224/48
Abstract: 提供了形成半导体封装件的方法。具体实施方式包括在管芯背面(16)形成具有多个子层(40‑46)的中间金属层(26)，每个子层包含金属，所述金属选自钛、镍、铜、银、以及它们的组合。将锡层(48)沉积到所述中间金属层(26)上，然后与衬底(50)的银层(52)一起进行回流焊以形成熔融温度大于260摄氏度并包括银和锡组成的金属间化合物和/或铜和锡组成的金属间化合物的金属间化合物层(56)。形成半导体封装件的另一种方法包括在管芯(14)的顶侧(18)上的多个裸露焊盘(20)中的每个裸露焊盘上形成凸块(22)，每个裸露焊盘(20)由钝化层(24)所包围，每个凸块(22)包括如上所述的中间金属层(36)和耦接到所述中间金属层(36)的锡层(48)，锡层(48)然后被以衬底(50)的银层(52)回流焊以形成如上所述的金属间化合物层(64)。
-
公开(公告)号：CN103534795B
公开(公告)日：2016-09-21
申请号：CN201280022991.2
申请日：2012-08-13
Applicant: 株式会社爱发科
CPC classification number: C23C14/165 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/74 , H01L24/741 , H01L24/743 , H01L24/77 , H01L24/83 , H01L24/84 , H01L2224/0345 , H01L2224/04026 , H01L2224/04034 , H01L2224/05655 , H01L2224/2745 , H01L2224/291 , H01L2224/29111 , H01L2224/32013 , H01L2224/32106 , H01L2224/32245 , H01L2224/32503 , H01L2224/37124 , H01L2224/37147 , H01L2224/37565 , H01L2224/37655 , H01L2224/40499 , H01L2224/40507 , H01L2224/4051 , H01L2224/4052 , H01L2224/4111 , H01L2224/74 , H01L2224/741 , H01L2224/83002 , H01L2224/83011 , H01L2224/8302 , H01L2224/83447 , H01L2224/83455 , H01L2224/8381 , H01L2224/83815 , H01L2224/84002 , H01L2224/84011 , H01L2224/8402 , H01L2224/8481 , H01L2224/84815 , H01L2224/03 , H01L2924/00014 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/0103 , H01L2924/01083 , H01L2924/01049 , H01L2924/01051 , H01L2924/01028 , H01L2924/0105 , H01L2224/743 , H01L2224/404 , H01L2224/77
Abstract: 本发明的部件的制造方法，其至少依次具备如下工序：工序A1，使用一侧的面由镍形成的基板，在所述一侧的面上通过溅射法形成以锡为主成分的合金膜；工序A3，在所述合金膜上，载置至少与所述合金膜的接触部位由铜和被镍包覆的铝中的任一个构成的部件；和工序A4，为了分别接合所述基板与所述合金膜之间以及所述合金膜与所述部件之间，实施热处理，在所述工序A1中，在减压气氛的空间内，对置阴极电极和阳极电极，在所述基板的所述一侧的面上形成所述合金膜时，向所述阴极电极施加DC电压，其中，所述阴极电极设有以锡为主成分的合金靶，所述设有所述基板。
-
公开(公告)号：CN103534795A
公开(公告)日：2014-01-22
申请号：CN201280022991.2
申请日：2012-08-13
Applicant: 株式会社爱发科
CPC classification number: C23C14/165 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/74 , H01L24/741 , H01L24/743 , H01L24/77 , H01L24/83 , H01L24/84 , H01L2224/0345 , H01L2224/04026 , H01L2224/04034 , H01L2224/05655 , H01L2224/2745 , H01L2224/291 , H01L2224/29111 , H01L2224/32013 , H01L2224/32106 , H01L2224/32245 , H01L2224/32503 , H01L2224/37124 , H01L2224/37147 , H01L2224/37565 , H01L2224/37655 , H01L2224/40499 , H01L2224/40507 , H01L2224/4051 , H01L2224/4052 , H01L2224/4111 , H01L2224/74 , H01L2224/741 , H01L2224/83002 , H01L2224/83011 , H01L2224/8302 , H01L2224/83447 , H01L2224/83455 , H01L2224/8381 , H01L2224/83815 , H01L2224/84002 , H01L2224/84011 , H01L2224/8402 , H01L2224/8481 , H01L2224/84815 , H01L2224/03 , H01L2924/00014 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/0103 , H01L2924/01083 , H01L2924/01049 , H01L2924/01051 , H01L2924/01028 , H01L2924/0105 , H01L2224/743 , H01L2224/404 , H01L2224/77
Abstract: 本发明的部件的制造方法，其至少依次具备如下工序：工序A1，使用一侧的面由镍形成的基板，在所述一侧的面上通过溅射法形成以锡为主成分的合金膜；工序A3，在所述合金膜上，载置至少与所述合金膜的接触部位由铜和被镍包覆的铝中的任一个构成的部件；和工序A4，为了分别接合所述基板与所述合金膜之间以及所述合金膜与所述部件之间，实施热处理，在所述工序A1中，在减压气氛的空间内，对置阴极电极和阳极电极，在所述基板的所述一侧的面上形成所述合金膜时，向所述阴极电极施加DC电压，其中，所述阴极电极设有以锡为主成分的合金靶，所述设有所述基板。
-
-
Search Results
3
records
(took 0.01 seconds)
