Patent search cpc:"H01L2224/43825" Page 1

1.

发明公开
用于接合应用的涂覆线无效

公开(公告)号：CN105745356A

公开(公告)日：2016-07-06

申请号：CN201380081083.5

申请日：2013-11-21

Applicant: 贺利氏德国有限两合公司

Inventor： A.卢卡斯 , P.温策尔 , M.多伊施勒 , E.米尔克 , S.托马斯 , J.沙夫

IPC: C23C26/00 , C23C18/08 , C23C30/00 , C23C14/00 , C23C16/00 , H01L21/00 , C23C18/02

CPC classification number: B23K35/40 , B23K20/007 , B23K20/10 , B23K35/0261 , B23K35/0272 , B23K35/30 , B23K35/3006 , B23K35/302 , B23K35/322 , B23K35/404 , B23K2101/42 , C22F1/08 , C23C14/14 , C23C18/08 , C23C28/00 , C23C30/00 , C23F17/00 , C25D5/34 , C25D7/0607 , H01B1/026 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/745 , H01L24/85 , H01L2224/05124 , H01L2224/05624 , H01L2224/4321 , H01L2224/43823 , H01L2224/43825 , H01L2224/43826 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45147 , H01L2224/45565 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45663 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/45678 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/48824 , H01L2224/85181 , H01L2224/85205 , H01L2224/85444 , H01L2924/00011 , H01L2924/01076 , H01L2924/12044 , H01L2924/181 , H05K1/09 , H05K2201/10287 , H05K2203/049 , Y10T428/12875 , Y10T428/12889 , H01L2924/00014 , H01L2924/00 , H01L2924/20109 , H01L2924/2011 , H01L2924/01029 , H01L2924/01047 , H01L2924/01046 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/01014 , H01L2924/013 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/00012 , H01L2924/01006 , H01L2924/01001 , H01L2924/01008 , H01L2924/01007 , H01L2924/01204 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/00013 , H01L2924/01049 , H01L2924/01005 , H01L2924/01015 , H01L2924/01033

Abstract: 本发明涉及接合线，其包含具有表面（15）的芯（2）和涂层（3），其中芯（2）包含选自铜和银的芯主要组分，涂层（3）至少部分叠加在芯（2）的表面（15）上，其中涂层（3）包含选自钯、铂、金、铑、钌、锇和铱的涂层组分，其中通过使液体的膜沉积在线芯前体上从而将涂层施加在芯的表面上，其中所述液体包含涂层组分前体，并且其中加热所沉积的膜以使涂层组分前体分解成金属相。

2.

发明公开
用于接合应用的涂覆线材无效

公开(公告)号：CN104937140A

公开(公告)日：2015-09-23

申请号：CN201380071250.8

申请日：2013-12-18

Applicant: 贺利氏德国有限责任两合公司

Inventor： E.米尔克 , J.沙尔夫

IPC: C23C26/00 , C23C18/08 , C23C30/00 , C23C14/00 , C23C16/00 , H01L21/00

CPC classification number: B23K20/007 , B23K20/10 , B23K35/0261 , B23K35/0272 , B23K35/30 , B23K35/3006 , B23K35/302 , B23K35/322 , B23K35/40 , B23K35/404 , B23K2101/42 , C23C14/14 , C23C18/08 , C23C28/00 , C23C30/00 , C25D5/34 , C25D7/0607 , H01B1/026 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/745 , H01L24/78 , H01L24/85 , H01L2224/05624 , H01L2224/43125 , H01L2224/432 , H01L2224/4321 , H01L2224/435 , H01L2224/43823 , H01L2224/43825 , H01L2224/43826 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45663 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/45678 , H01L2224/48091 , H01L2224/48247 , H01L2224/4845 , H01L2224/48455 , H01L2224/48465 , H01L2224/48472 , H01L2224/48824 , H01L2224/85181 , H01L2224/85801 , H01L2924/00011 , H01L2924/01076 , H01L2924/12044 , H01L2924/181 , H05K1/09 , H05K3/34 , H05K2201/10287 , H05K2203/049 , Y10T428/12875 , Y10T428/12889 , H01L2924/00014 , H01L2924/00 , H01L2924/20109 , H01L2924/2011 , H01L2924/01046 , H01L2924/01006 , H01L2924/01001 , H01L2924/01008 , H01L2924/01007 , H01L2924/01204 , H01L2924/013 , H01L2924/20751 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20752 , H01L2924/01014 , H01L2924/01029 , H01L2924/00013 , H01L2924/00012 , H01L2924/01049 , H01L2924/01005 , H01L2924/01004 , H01L2924/01033

Abstract: 本发明涉及一种接合线材，其包含具有表面的芯，其中所述芯包含选自铜和银的芯主要组分；和至少部分地覆盖在所述芯的表面上的涂覆层，其中所述涂覆层以至少10%的量包含选自钯、铂、金、铑、钌、锇和铱的涂覆组分作为组分；其特征在于所述涂覆层以至少10%的量包含所述芯的主要组分作为组分。

3.

发明授权
具有改良的接合和腐蚀特性的铜制接合线或超细线失效

公开(公告)号：CN101138086B

公开(公告)日：2011-08-31

申请号：CN200680007576.4

申请日：2006-02-24

Applicant: W.C.贺利氏有限公司

Inventor： 阿尔布雷希特·比朔夫 , 海因茨·弗德雷尔 , 卢茨·施雷普勒 , 弗兰克·克吕格尔

IPC: H01L23/49

CPC classification number: H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/05624 , H01L2224/43825 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/45664 , H01L2224/45673 , H01L2224/48463 , H01L2224/48624 , H01L2224/85045 , H01L2224/85205 , H01L2224/859 , H01L2924/00011 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/01204 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/19042 , H01L2924/20752 , Y10S428/941 , Y10T428/12431 , Y10T428/12438 , Y10T428/12458 , Y10T428/2938 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2924/00015 , H01L2924/20755 , H01L2924/2075 , H01L2924/2076 , H01L2924/20754 , H01L2924/01049 , H01L2924/01006

Abstract: 本发明涉及一种表面富含金的铜制接合线或超细线，特别地，金的含量对应于最大50nm厚的外层。或者，所述接合线或超细线可以按照球-楔接合方法进行接合，其呈现铜的颜色，并且，其火焰球具有值为95的硬度(HVO.002)。为了制造所述接合线或超细线，可以在铜线上涂以金或铜-金合金外层，或将金引入铜线表面。所述接合线或超细线和半导体硅芯片接合在一起。

4.

发明公开
半导体装置用接合线有权转让

公开(公告)号：CN101828255A

公开(公告)日：2010-09-08

申请号：CN200880112031.9

申请日：2008-12-03

Applicant: 新日铁高新材料株式会社 , 日铁新材料股份有限公司

Inventor： 宇野智裕 , 木村圭一 , 山田隆

IPC: H01L21/60 , C22C5/02 , C22C5/04 , C22C5/06 , C22C9/00

CPC classification number: C22C5/02 , B23K35/0222 , B23K35/302 , C22C5/04 , C22C5/06 , C22C9/00 , C22C9/01 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/45683 , H01L2224/48011 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/48486 , H01L2224/4851 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48839 , H01L2224/48844 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85186 , H01L2224/85203 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2924/00011 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01203 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/3025 , H01L2924/01004 , H01L2924/01001 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/00015 , H01L2924/01202 , H01L2224/45655 , H01L2224/45657 , H01L2224/45671 , H01L2224/45666 , H01L2924/20652 , H01L2924/20653 , H01L2924/20654 , H01L2924/20655 , H01L2924/20656 , H01L2924/20658 , H01L2224/48227 , H01L2924/00 , H01L2224/48824 , H01L2924/013 , H01L2924/00014 , H01L2924/0104 , H01L2924/00013 , H01L2924/01049 , H01L2924/01006

Abstract: 本发明的目的是提供可以降低颈部的损伤，并且在环路的直线性、环路高度的稳定性、接合线的接合形状的稳定化方面优异的也适应于低环路化、细线化、窄间距化、三维组装等的半导体组装技术的高功能的接合线。本发明的半导体装置用接合线，是具有由导电性金属形成的芯材和在所述芯材上的以与芯材不同的面心立方晶的金属为主成分的表皮层的接合线，其特征在于，在所述表皮层的表面中的纵向的晶体取向之中，所占的比例为50％以上。

5.

发明授权
一种键合丝有权

公开(公告)号：CN105428335B

公开(公告)日：2017-12-26

申请号：CN201510899336.0

申请日：2015-12-09

Applicant: 北京达博有色金属焊料有限责任公司

Inventor： 梁忠 , 谢允昊 , 闫茹 , 向翠华 , 周晓光 , 苏宏福

IPC: H01L23/48 , H01L21/60 , C22C5/06 , C25D5/10 , C25D3/50

CPC classification number: H01L2224/43 , H01L2224/4321 , H01L2224/4381 , H01L2224/43825 , H01L2224/45 , H01L2224/45139 , H01L2224/45144 , H01L2224/45573 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2924/00011 , H01L2924/01079 , H01L2924/01046 , H01L2924/013 , H01L2924/01204 , H01L2924/01205 , H01L2924/00013 , H01L2924/00012 , H01L2924/00 , H01L2924/01005

Abstract: 本发明公开了一种键合丝，该键合丝由键合丝基体和包覆在键合丝基体外的三层镀层构成，键合丝基体为金银钯合金，三层镀层由内向外依次为金镀层、钯镀层、铂镀层，并且铂镀层在三层镀层中的厚度最厚。本发明的键合丝具有三层镀层结构，其抗氧化硫化性强，能解决银的迁移问题，电子封装后道性能稳定性好，且制备成本低，可完全取代金丝。

6.

发明授权
半导体装置用接合线有权转让

公开(公告)号：CN102842539B

公开(公告)日：2015-06-24

申请号：CN201210313521.3

申请日：2008-07-24

Applicant: 新日铁住金高新材料株式会社 , 日铁住金新材料股份有限公司

Inventor： 宇野智裕 , 木村圭一 , 寺嶋晋一 , 山田隆 , 西林景仁

IPC: H01L23/00

CPC classification number: H01L24/85 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43847 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/456 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/45664 , H01L2224/45669 , H01L2224/45671 , H01L2224/45673 , H01L2224/4568 , H01L2224/45684 , H01L2224/48011 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48463 , H01L2224/48472 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48724 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/78251 , H01L2224/78301 , H01L2224/85045 , H01L2224/85048 , H01L2224/85065 , H01L2224/85075 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01105 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/15747 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/3025 , H01L2924/3861 , H01L2924/01001 , H01L2924/01203 , H01L2924/01034 , H01L2924/01081 , H01L2924/20645 , H01L2924/20652 , H01L2924/20653 , H01L2924/00014 , H01L2924/20108 , H01L2224/45657 , H01L2224/45666 , H01L2924/01008 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/2076 , H01L2924/2065 , H01L2924/20651 , H01L2924/20654 , H01L2924/00 , H01L2224/45124 , H01L2924/013 , H01L2924/20751 , H01L2924/2075 , H01L2924/00013 , H01L2924/01049

Abstract: 本发明的目的是提供材料费廉价且球接合性、热循环试验或软熔试验的可靠性优异、保管寿命也良好的也适应于窄间距用细线化的铜系接合线。本发明的半导体装置用接合线是具有以铜为主成分的芯材、和设置在所述芯材上的含有成分和组成的某一方或两方与所述芯材不同的金属M和铜的外层的接合线，其特征在于，所述外层的厚度为0.021～0.12μm，所述金属M为Pd，所述外层为含有50mol%以上的Pd的部位。

7.

发明公开
具有表皮层的封装焊线的制备方法及其成品无效

公开(公告)号：CN104658916A

公开(公告)日：2015-05-27

申请号：CN201410362538.7

申请日：2014-07-28

Applicant: 大亚电线电缆股份有限公司

Inventor： 吕宗鸿 , 赵健佑

IPC: H01L21/48 , H01L23/49

CPC classification number: H01L2224/43 , H01L2224/4321 , H01L2224/43825 , H01L2224/43848 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/4516 , H01L2224/4554 , H01L2224/45565 , H01L2924/2011 , H01L2924/20111 , H01L2924/20755 , H01L2924/01204 , H01L2924/01047 , H01L2924/01026 , H01L2924/01025 , H01L2924/01033 , H01L2924/0102 , H01L2924/01012 , H01L2924/01016 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2224/45664 , H01L2224/45644 , H01L2224/45639 , H01L2224/45669 , H01L2924/01206 , H01L2924/00012 , H01L2924/00015 , H01L2924/01015

Abstract: 本发明提供一种具有表皮层的封装焊线的制备方法及其成品。该制备方法包括：先使用具有适当减面率的眼模伸线加工母材获得芯材；再于芯材上电镀形成抗氧化层，并于抗氧化层上形成表皮层；另热处理包覆有抗氧化层及表皮层的芯材，以获得具有表皮层的封装焊线。依据本发明，由于其先进行伸线加工再进行电镀工艺，故因伸线加工而形成于芯材表面的裂痕能通过电镀工艺加以填补，使抗氧化层得以完整包覆于芯材表面，且表皮层能完整包覆于抗氧化层表面，解决现有技术的封装焊线常因形成于抗氧化层的裂痕而降低半导体装置的品质的问题。