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公开(公告)号：CN104465473A
公开(公告)日：2015-03-25
申请号：CN201410475480.7
申请日：2014-09-17
Applicant: 新科金朋有限公司
IPC: H01L21/68 , H01L23/544
CPC classification number: H01L23/36 , H01L21/561 , H01L23/3128 , H01L23/42 , H01L23/49816 , H01L23/49822 , H01L23/544 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/73 , H01L24/92 , H01L24/97 , H01L25/065 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/29012 , H01L2224/29013 , H01L2224/29014 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83191 , H01L2224/92125 , H01L2224/92225 , H01L2224/97 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2924/00
Abstract: 一种集成电路封装系统及其制造方法，所述系统包括：衬底；形成在所述衬底上的模盖；在所述模盖中刻划的基准标记；被施加在所述衬底上并且参照所述基准标记的热界面材料；以及安装在所述热界面材料上的散热件，所述散热件通过相对于所述基准标记对齐的定位缺口被准确地定位。
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公开(公告)号：CN104465473B
公开(公告)日：2018-05-01
申请号：CN201410475480.7
申请日：2014-09-17
Applicant: 新科金朋有限公司
IPC: H01L21/68 , H01L23/544
CPC classification number: H01L23/36 , H01L21/561 , H01L23/3128 , H01L23/42 , H01L23/49816 , H01L23/49822 , H01L23/544 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/73 , H01L24/92 , H01L24/97 , H01L25/065 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/29012 , H01L2224/29013 , H01L2224/29014 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/83191 , H01L2224/92125 , H01L2224/92225 , H01L2224/97 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2924/00
Abstract: 一种集成电路封装系统及其制造方法，所述系统包括：衬底；形成在所述衬底上的模盖；在所述模盖中刻划的基准标记；被施加在所述衬底上并且参照所述基准标记的热界面材料；以及安装在所述热界面材料上的散热件，所述散热件通过相对于所述基准标记对齐的定位缺口被准确地定位。
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