Invention Grant
- Patent Title: Temperature compensated compound resonator
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Application No.: US14874514Application Date: 2015-10-05
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Publication No.: US09991869B2Publication Date: 2018-06-05
- Inventor: Antti Jaakkola , Panu Pekko , Mika Prunnila , Tuomas Pensala
- Applicant: Teknologian tutkimuskeskus VTT Oy
- Applicant Address: FI Espoo
- Assignee: Teknologian tutkimuskeskus VTT Oy
- Current Assignee: Teknologian tutkimuskeskus VTT Oy
- Current Assignee Address: FI Espoo
- Agency: Seppo Laine Oy
- Priority: FI20145870 20141003
- Main IPC: H03H3/013
- IPC: H03H3/013 ; H03H9/02 ; H03H9/05 ; H03H9/24 ; H03H3/007

Abstract:
The invention concerns microelectromechanical resonators. In particular, the invention provides a resonator comprising a support structure, a doped semiconductor resonator suspended to the support structure by at least one anchor, and actuator for exciting resonance into the resonator. According to the invention, the resonator comprises a base portion and at least one protrusion extending outward from the base portion and is excitable by said actuator into a compound resonance mode having temperature coefficient of frequency (TCF) characteristics, which are contributed by both the base portion and the at least one protrusion. The invention enables simple resonators, which are very well temperature compensated over a wide temperature range.
Public/Granted literature
- US20160099702A1 Temperature compensated compound resonator Public/Granted day:2016-04-07
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