A memory module is disclosed. The memory module may have an enclosure and a device disposed within the enclosure. The memory module may also have an orifice in a wall of the enclosure and a wire passing through the orifice. One end of the wire may be attached to the device. The memory module may further have a stopper attached to the wire. The stopper may be located abutting an outer surface of the enclosure. The memory module may also have a filler disposed within the enclosure. The filler may be configured to expand and be ejected out of the orifice when subjected to a threshold temperature. The filler may also be configured to push the stopper away from the outer surface and disconnect the wire from the device.