Invention Grant
- Patent Title: Method for manufacturing semiconductor laser device including wavelength converting member and light transmissive member
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Application No.: US15352248Application Date: 2016-11-15
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Publication No.: US09991672B2Publication Date: 2018-06-05
- Inventor: Naoto Morizumi , Yukihiro Hayashi
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2013-139674 20130703; JP2013-241042 20131121
- Main IPC: F21V9/16
- IPC: F21V9/16 ; F21V8/00 ; H01S5/022 ; F21K99/00 ; H01S5/00 ; H01S3/00 ; F21K9/64 ; F21Y101/02 ; F21Y101/00 ; F21Y115/30

Abstract:
The light emitting device according to the present invention comprises a laser diode; a wavelength converting member which is configured to convert a wavelength of a light emitted from the laser diode; and a support member which is configured to support the wavelength converting member so that the light passes through two surfaces of the wavelength converting member. The wavelength converting member comprises a fluorescent material and a binder. At least one light transmissive member is disposed on at least one of these two surfaces of the wavelength converting member. The binder has a melting point higher than a melting point of the light transmissive member. The light transmissive member is fixed to the support member by fusion bonding.
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