Invention Grant
- Patent Title: Image pickup device having an infrared absorption layer between a laminate band-pass layer and a low refractive index layer above on-chip lenses
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Application No.: US15024146Application Date: 2014-11-20
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Publication No.: US09991304B2Publication Date: 2018-06-05
- Inventor: Nozomi Kimura , Shinji Imaizumi
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2013-244424 20131126; JP2014-085056 20140416
- International Application: PCT/JP2014/005839 WO 20141120
- International Announcement: WO2015/079662 WO 20150604
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G02B5/22 ; G02B5/26 ; H01L31/09

Abstract:
An image pickup device according to the present technique includes an on-chip lens, a low-refractive-index layer, and an infrared absorption layer. The on-chip lens is formed of a high-refractive-index material. The low-refractive-index layer is formed flat on the on-chip lens and formed of a low-refractive-index material. The infrared absorption layer is formed of an infrared absorption material and laminated as a higher layer than the low-refractive-index layer. The infrared absorption material includes an infrared absorption pigment and a binder resin, the binder resin, being a synthetic resin constituted of a siloxane skeleton alone or a synthetic resin constituted of a siloxane skeleton part and a partial skeleton having a low reaction activity in an oxygen part.
Public/Granted literature
- US20160293650A1 IMAGE PICKUP DEVICE Public/Granted day:2016-10-06
Information query
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