• Patent Title: Image pickup device having an infrared absorption layer between a laminate band-pass layer and a low refractive index layer above on-chip lenses
  • Application No.: US15024146
    Application Date: 2014-11-20
  • Publication No.: US09991304B2
    Publication Date: 2018-06-05
  • Inventor: Nozomi KimuraShinji Imaizumi
  • Applicant: SONY CORPORATION
  • Applicant Address: JP Tokyo
  • Assignee: SONY CORPORATION
  • Current Assignee: SONY CORPORATION
  • Current Assignee Address: JP Tokyo
  • Agency: Chip Law Group
  • Priority: JP2013-244424 20131126; JP2014-085056 20140416
  • International Application: PCT/JP2014/005839 WO 20141120
  • International Announcement: WO2015/079662 WO 20150604
  • Main IPC: H01L27/146
  • IPC: H01L27/146 G02B5/22 G02B5/26 H01L31/09
Image pickup device having an infrared absorption layer between a laminate band-pass layer and a low refractive index layer above on-chip lenses
Abstract:
An image pickup device according to the present technique includes an on-chip lens, a low-refractive-index layer, and an infrared absorption layer. The on-chip lens is formed of a high-refractive-index material. The low-refractive-index layer is formed flat on the on-chip lens and formed of a low-refractive-index material. The infrared absorption layer is formed of an infrared absorption material and laminated as a higher layer than the low-refractive-index layer. The infrared absorption material includes an infrared absorption pigment and a binder resin, the binder resin, being a synthetic resin constituted of a siloxane skeleton alone or a synthetic resin constituted of a siloxane skeleton part and a partial skeleton having a low reaction activity in an oxygen part.
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