Invention Grant
- Patent Title: Image sensor device structure
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Application No.: US14658465Application Date: 2015-03-16
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Publication No.: US09991303B2Publication Date: 2018-06-05
- Inventor: Hung-Wen Hsu , Ching-Chung Su , Cheng-Hsien Chou , Jiech-Fun Lu , Shih-Pei Chou , Yeur-Luen Tu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor structure is provided. The image sensor device structure includes a substrate, and the substrate includes an array region and a peripheral region. The image sensor device structure includes an anti-reflection layer formed on the substrate and a buffer layer formed on the anti-reflection layer. The image sensor device structure includes a first etch stop layer formed on the buffer layer and a metal grid structure formed on the first etch stop layer. The image sensor device structure also includes a dielectric layer formed on the metal grid structure.
Public/Granted literature
- US20160276386A1 IMAGE SENSOR DEVICE STRUCTURE Public/Granted day:2016-09-22
Information query
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