Invention Grant
- Patent Title: Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same
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Application No.: US14958928Application Date: 2015-12-03
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Publication No.: US09991245B2Publication Date: 2018-06-05
- Inventor: Jae Choon Kim , Donghan Kim , Jikho Song , Mitsuo Umemoto , Inho Choi
- Applicant: Jae Choon Kim , Donghan Kim , Jikho Song , Mitsuo Umemoto , Inho Choi
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2015-0002873 20150108
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/10 ; H01L23/34 ; H01L25/00 ; H01L23/367 ; H01L23/00 ; H01L25/10 ; H01L23/498 ; H01L23/31 ; H01L23/538
Abstract:
A semiconductor package comprising: a semiconductor chip; a connection pillar that is disposed adjacent to the semiconductor chip; a first heat dissipation layer disposed on the semiconductor chip; and a second heat dissipation layer disposed on the first heat dissipation layer, the second heat dissipation layer including a first protrusion extending beyond a perimeter of the semiconductor chip and extending towards the connection pillar.
Public/Granted literature
- US20160204080A1 SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME Public/Granted day:2016-07-14
Information query
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