Invention Grant
- Patent Title: Air-cavity package with enhanced package integration level and thermal performance
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Application No.: US15409885Application Date: 2017-01-19
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Publication No.: US09991181B2Publication Date: 2018-06-05
- Inventor: Walid M. Meliane , Kevin J. Anderson , Tarak A. Railkar
- Applicant: Qorvo US, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/10 ; H01L23/367 ; H01L23/498 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L21/56 ; H01L23/31 ; H01L23/04 ; H01L21/50 ; H01L23/66
Abstract:
The present disclosure relates to an air-cavity package, which includes a bottom substrate, a top substrate, a perimeter wall, a bottom electronic component, a top electronic component, and an external electronic component. The perimeter wall extends from a periphery of a lower side of the top substrate to a periphery of an upper side of the bottom substrate to form a cavity. The bottom electronic component is mounted on the upper side of the bottom substrate and exposed to the cavity. The top electronic component is mounted on the lower side of the top substrate and exposed to the cavity. And the external electronic component is mounted on an upper side of the top substrate, which is opposite the lower side of the top substrate and not exposed to the cavity.
Public/Granted literature
- US20180061725A1 AIR-CAVITY PACKAGE WITH ENHANCED PACKAGE INTEGRATION LEVEL AND THERMAL PERFORMANCE Public/Granted day:2018-03-01
Information query
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