An electrowetting device is provided that includes a lower substrate and an upper substrate facing each other, a first electrode positioned on the lower substrate, an edge electrode positioned on the lower substrate and adjacent to an edge of the first electrode, a hydrophobic insulating layer positioned on the first electrode and the edge electrode, a partition positioned on the lower substrate, a second electrode positioned on the upper substrate, and a first liquid and a second liquid positioned between the upper substrate and the lower substrate, wherein an electric field of a portion where the edge electrode is positioned is smaller than an electric field of a portion where the first electrode is positioned.