Invention Grant
- Patent Title: Apparatus for testing multiple semiconductor dice with increased throughput
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Application No.: US14708380Application Date: 2015-05-11
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Publication No.: US09989587B2Publication Date: 2018-06-05
- Inventor: Yam Mo Wong , Kui Kam Lam , Kai Siu Lam , Ka Wai Chan
- Applicant: ASM Technology Singapore Pte Ltd
- Applicant Address: SG Singapore
- Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
- Current Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Ostrolenk Faber LLP
- Main IPC: G01R31/308
- IPC: G01R31/308 ; G01R31/28

Abstract:
A die tester comprising a testing table on which a plurality of dice arranged in an array are mountable, and a first probe and a second probe that are adjustable to a fixed position with a fixed separation distance between the first probe and the second probe. The fixed position corresponds to predetermined test points on the plurality of dice, and the testing table and the first and second probes are movable relative to each other so as to position test points of a first die of the plurality of dice to the first probe and the second probe for testing the first die. The die tester further comprises movable third and fourth probes that are movable relative to each other and positionable to test points on a second die of the plurality of dice for testing the second die.
Public/Granted literature
- US20160334464A1 APPARATUS FOR TESTING MULTIPLE SEMICONDUCTOR DICE WITH INCREASED THROUGHPUT Public/Granted day:2016-11-17
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