Invention Grant
- Patent Title: Power inductor encapsulated through injection molding
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Application No.: US15706696Application Date: 2017-09-16
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Publication No.: US09987777B2Publication Date: 2018-06-05
- Inventor: Zhi Huang
- Applicant: Magsonder Innovation(Shanghai) Co., Ltd.
- Agency: Wayne & Ken, LLC
- Agent Tony Hom
- Priority: CN201510185528 20150417
- Main IPC: H01F5/00
- IPC: H01F5/00 ; B29C45/00 ; H02J50/10 ; H01F27/29

Abstract:
The present invention discloses a power inductor encapsulated through injection molding. The power inductor comprises a coil winding, a soft magnetic ferrite middle column inserted in a middle of the coil winding, and a magnetic powder glue for encapsulating the coil winding and the soft magnetic ferrite middle column through injection molding. The power inductor is square and meets L≥W and 2rc>0.4×2W, wherein a section width of the soft magnetic ferrite middle column perpendicular to a height direction of the inductor is 2rc, a length of the power inductor is 2L, and a width of the power inductor is 2W. According to the present invention, a balanced direct-current resistance and a direct-current superposition saturation characteristic can be obtained, and the direct-current resistance is greatly decreased while an excellent direct-current superposition saturation characteristic is ensured.
Public/Granted literature
- US20180001523A1 POWER INDUCTOR ENCAPSULATED THROUGH INJECTION MOLDING Public/Granted day:2018-01-04
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