A mold capable of inhibiting supercooling is provided. The mold includes a cooling channel formed therein and has a recess formed in a cavity surface, and a heat-insulating barrier formed between the cooling channel and a bottom surface of the recess formed in the cavity surface. The heat-insulating barrier includes a space formed between the cooling channel and the bottom surface of the recess formed in the cavity surface. The space is filled with a medium (for example, air) having a thermal conductivity lower than that of other portions of the mold.