Invention Grant
- Patent Title: Plasma spraying apparatus
-
Application No.: US13716757Application Date: 2012-12-17
-
Publication No.: US09987703B2Publication Date: 2018-06-05
- Inventor: Masanobu Sugimoto , Kenichi Yamada , Masanobu Irie
- Applicant: FUJI ENGINEERING CO., LTD. , FUJIGIKEN CO., LTD. , WEST NIPPON EXPRESSWAY COMPANY LIMITED
- Applicant Address: JP Osaka JP Osaka JP Osaka
- Assignee: FUJI ENGINEERING CO., LTD.,FUJIGIKEN CO., LTD.,WEST NIPPON EXPRESSWAY COMPANY LIMITED
- Current Assignee: FUJI ENGINEERING CO., LTD.,FUJIGIKEN CO., LTD.,WEST NIPPON EXPRESSWAY COMPANY LIMITED
- Current Assignee Address: JP Osaka JP Osaka JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Main IPC: B23K10/00
- IPC: B23K10/00 ; B23K10/02 ; B05B7/22

Abstract:
The plasma spraying apparatus includes a cathode, a first gas nozzle defining a first gas path between the cathode and itself, a second gas nozzle defining a second gas path between the first gas nozzle and itself, and a third gas nozzle disposed between the first and second gas nozzles to define a third gas path between the first and second gas paths. A wire is disposed at a distal end thereof in front of a nozzle opening of the second gas nozzle. A first gas sprayed through the first gas nozzle is turned into plasma flame, which melts the wire into droplets, and the droplets are sprayed onto a target by a second gas sprayed through the second gas nozzle. The third gas absorbs heat from the plasma flame to thereby turn into a high-temperature gas flow externally of the plasma flame.
Public/Granted literature
- US20140166625A1 PLASMA SPRAYING APPARATUS Public/Granted day:2014-06-19
Information query