- Patent Title: 3D EMI suppression structure and electronic device having the same
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Application No.: US15213305Application Date: 2016-07-18
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Publication No.: US09967968B2Publication Date: 2018-05-08
- Inventor: Kuo Ying Hung
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: CN201510543646 20150828; TW104128267A 20150828
- Main IPC: H04B3/28
- IPC: H04B3/28 ; H05K1/02 ; H01P3/02 ; H05K1/11 ; H01P5/02

Abstract:
A 3D Electromagnetic Interference (EMI) suppression structure and an electronic device having the same, wherein a coplanar waveguide structure, an isolation layer, and a resonance layer may be installed. Furthermore, under the coplanar waveguide structure, the 3D EMI structure may be installed to connect to a conductor part of the resonance layer through a conductive connection part of the isolation layer, thereby further improving the EMI suppression effect and producing an excellent EMI suppression effect.
Public/Granted literature
- US20170064815A1 3D EMI SUPPRESSION STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME Public/Granted day:2017-03-02
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