Invention Grant
- Patent Title: System and method for an integrated transducer and temperature sensor
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Application No.: US14613106Application Date: 2015-02-03
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Publication No.: US09967679B2Publication Date: 2018-05-08
- Inventor: Ulrich Krumbein , Alfons Dehe
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H04R23/00
- IPC: H04R23/00 ; B81B7/02 ; H04R17/02 ; H04R19/00 ; H04R19/04 ; H04R31/00 ; H04R19/01 ; H04R19/02
Abstract:
According to embodiment, a transducer includes a microfabricated element integrated on a single die and an interface IC coupled to the microfabricated element. The microfabricated element includes an acoustic transducer and a temperature sensor, and the interface IC is electrically coupled to the acoustic transducer and the temperature sensor.
Public/Granted literature
- US20160221822A1 System and Method for an Integrated Transducer and Temperature Sensor Public/Granted day:2016-08-04
Information query
