Invention Grant
- Patent Title: Charge-coupled device, manufacturing method thereof, and solid-state imaging element
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Application No.: US15033408Application Date: 2014-10-31
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Publication No.: US09967503B2Publication Date: 2018-05-08
- Inventor: Shin-ichiro Takagi , Yasuhito Yoneta , Hisanori Suzuki , Masaharu Muramatsu
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2013-229743 20131105
- International Application: PCT/JP2014/079141 WO 20141031
- International Announcement: WO2015/068668 WO 20150514
- Main IPC: H04N5/378
- IPC: H04N5/378 ; H01L27/146 ; H01L27/148 ; H04N5/225

Abstract:
Each pixel region PX includes a photoelectric conversion region S1, a resistive gate electrode R, a first transfer electrode T1, a second transfer electrode T2, a barrier region B positioned directly beneath the first transfer electrode T1 in a semiconductor substrate 10, and a charge accumulation region S2 positioned directly beneath the second transfer electrode T2 in the semiconductor substrate 10. An impurity concentration of the barrier region B is lower than an impurity concentration of the charge accumulation region S2, and the first transfer electrode T1 and the second transfer electrode T2 are electrically connected to each other.
Public/Granted literature
- US20160286147A1 CHARGE-COUPLED DEVICE, MANUFACTURING METHOD THEREOF, AND SOLID-STATE IMAGING ELEMENT Public/Granted day:2016-09-29
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