Embodiments of the present disclosure provide apparatuses and methods for balancing parasitic capacitances between metal tracks in an integrated circuit chip. Specifically, additional capacitances in the form of, for example, tab capacitors, are attached to the metal tracks with the intention of detaching a select number of the attached capacitances for the purpose of balancing the parasitic capacitances between the metal tracks. The attached capacitances may be structural metal elements. Further, the attached structural metal elements may be detachable at thin-film resistive material associated with each of the attached structural metal elements.