Invention Grant
- Patent Title: Motor drive device assembly including plurality of motor drive devices, and motor drive device including heatsink
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Application No.: US15246641Application Date: 2016-08-25
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Publication No.: US09966896B2Publication Date: 2018-05-08
- Inventor: Ryouta Yamaguchi , Taku Sasaki , Kiichi Inaba
- Applicant: FANUC CORPORATION
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Fredrikson & Byron, P.A.
- Priority: JP2015-173010 20150902
- Main IPC: G05B11/32
- IPC: G05B11/32 ; H02P29/60 ; H02P29/02 ; H02P29/68 ; H02M7/00

Abstract:
A motor drive device assembly capable of suppressing differences in temperatures of motor drive devices depending on operational conditions. The motor drive device assembly includes a first motor drive device including a first heatsink, a second motor drive device located adjacent to the first motor drive device and including a second heatsink formed separately from the first heatsink, and a connection part connecting the first heatsink and the second heatsink to each other, to allow thermal conduction between the first heatsink and the second heatsink.
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