Provided are a photocurable pressure-sensitive adhesive composition including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator, an organic electronic device having an encapsulant including a photocured product of the composition using a curable pressure-sensitive adhesive film which is a film-state product including the composition, and a method for manufacturing an organic electronic device using the curable pressure-sensitive adhesive film. Particularly, due to the method including laminating a photocurable pressure-sensitive adhesive film including a curable pressure-sensitive adhesive layer including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator to an top substrate, and radiating light to an entire surface of the curable pressure-sensitive adhesive layer to perform photocuring, and laminating the photocured curable pressure-sensitive adhesive layer to a bottom substrate on which an organic light emitting element is formed to cover an entire surface of the organic light emitting element, mechanical strength and a simple process caused by photocuring to the organic light emitting element without direct light irradiation may be achieved, and a lifespan of the element may be increased.