Invention Grant
- Patent Title: LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
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Application No.: US14965083Application Date: 2015-12-10
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Publication No.: US09966517B2Publication Date: 2018-05-08
- Inventor: Kazunori Oda , Akira Sakamoto , Yoshinori Murata , Kenzaburo Kawai , Koichi Suzuki , Megumi Oishi
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2010-078854 20100330; JP2010-162086 20100716; JP2010-167298 20100726
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/62 ; H01L23/495 ; H01L33/52 ; H01L21/48 ; H01L21/56 ; H01L21/683 ; H01L33/48 ; H01L33/60 ; H01L23/31 ; H01L33/56 ; H01L23/498 ; H01L23/00
Abstract:
An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.
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