Invention Grant
- Patent Title: Method for processing an electronic component and an electronic component
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Application No.: US15716534Application Date: 2017-09-27
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Publication No.: US09966348B2Publication Date: 2018-05-08
- Inventor: Jens Peter Konrath , Jochen Hilsenbeck
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner mbB
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/00

Abstract:
According to various embodiments an electronic component includes: at least one electrically conductive contact region; a contact pad including a self-segregating composition disposed over the at least one electrically conductive contact region; a segregation suppression structure disposed between the contact pad and the at least one electrically conductive contact region, wherein the segregation suppression structure includes more nucleation inducing topography features than the at least one electrically conductive contact region for perturbing a chemical segregation of the self-segregating composition by crystallographic interfaces of the contact pad defined by the nucleation inducing topography features.
Public/Granted literature
- US20180019218A1 METHOD FOR PROCESSING AN ELECTRONIC COMPONENT AND AN ELECTRONIC COMPONENT Public/Granted day:2018-01-18
Information query
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