Invention Grant
- Patent Title: Electronic circuit package
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Application No.: US15464775Application Date: 2017-03-21
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Publication No.: US09966343B2Publication Date: 2018-05-08
- Inventor: Kenichi Kawabata , Toshio Hayakawa , Toshiro Okubo
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Young Law Firm, P.C.
- Priority: JP2016-058730 20160323
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L21/56 ; H01L21/78 ; H01L21/3205
Abstract:
Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a magnetic film formed of a composite magnetic material obtained by dispersing magnetic fillers in a thermosetting resin material, the magnetic film covering upper and side surfaces of the molding resin and an edge portion of the front surface exposed to a side surface of the substrate; and a metal film connected to the power supply pattern and covering the molding resin through the magnetic film.
Public/Granted literature
- US20170309576A1 ELECTRONIC CIRCUIT PACKAGE Public/Granted day:2017-10-26
Information query
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