A centering fixture for centering a wafer on a chuck is provided. The centering fixture includes a body including an upper surface, a lower surface, an inner periphery and an outer periphery. A chuck seat is positioned in a lower portion of the inner periphery and configured to mate the body with the chuck. A wafer seat is positioned in an upper portion of the inner periphery above the chuck seat, the wafer seat configured to receive and center the wafer on the chuck. The centering fixture ensures centering of the wafer relative to the chuck for automated handling system calibration. The wafer, body, chuck, chuck seat and wafer seat can be circular.