Invention Grant
- Patent Title: Substrate processing apparatus, method for manufacturing semiconductor device, and non-transitory computer-readable recording medium
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Application No.: US15024539Application Date: 2014-09-19
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Publication No.: US09966289B2Publication Date: 2018-05-08
- Inventor: Daigi Kamimura , Shigeru Odake , Tomoshi Taniyama , Takashi Nogami , Osamu Morita , Yasuaki Komae
- Applicant: HITACHIT KOKUSAI ELECTRIC INC.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: JP2013-204729 20130930
- International Application: PCT/JP2014/074865 WO 20140919
- International Announcement: WO2015/046062 WO 20150402
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B65G1/02
Abstract:
An apparatus and method capable of reducing the footprint of substrate processing system. An apparatus includes a housing chamber including a housing cabinet which houses housing containers for housing substrates, and a housing container carrying mechanism provided on the ceiling of the housing chamber and configured to carry the housing containers.
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