Invention Grant
- Patent Title: Alignment method, pattern formation system, and exposure device
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Application No.: US15015468Application Date: 2016-02-04
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Publication No.: US09966284B2Publication Date: 2018-05-08
- Inventor: Manabu Takakuwa
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-226578 20151119
- Main IPC: G03B27/68
- IPC: G03B27/68 ; H01L21/67 ; G03F7/20 ; H01L23/544
Abstract:
According to one embodiment, an alignment method includes calculating a position gap of a predetermined point in a device area of a wafer based on a stress applied to the device area, and correcting an exposure condition in a lithography process of the device area based on the position gap of the predetermined point.
Public/Granted literature
- US20170148656A1 ALIGNMENT METHOD, PATTERN FORMATION SYSTEM, AND EXPOSURE DEVICE Public/Granted day:2017-05-25
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