Invention Grant
- Patent Title: Multilayer coil
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Application No.: US15000663Application Date: 2016-01-19
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Publication No.: US09966183B2Publication Date: 2018-05-08
- Inventor: Kouji Yamauchi , Mitsuru Odahara
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2013-156447 20130729
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F7/06 ; H01F27/28 ; H01F17/00 ; H01F27/29

Abstract:
A coil is provided at a multilayer body including insulating layers stacked on one another. The coil includes linear conductors connected by via conductors to make a looped track when viewed from a layer stacking direction. The linear conductors include a first linear conductor contacting with an external electrode provided on the surface of the multilayer body, and a second linear conductor forming a half of the looped track. The first linear conductor includes a coil portion forming a part of the looped track. The second linear conductor is adjacent to the first linear conductor with one of the insulating layers in-between, and a first end of the second linear conductor is connected to a first end of the first linear conductor by a first via conductor. A second end of the second linear conductor does not overlap the first linear conductor when viewed from the layer stacking direction.
Public/Granted literature
- US20160133376A1 MULTILAYER COIL Public/Granted day:2016-05-12
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