Invention Grant
- Patent Title: Shielded conduction path
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Application No.: US15321283Application Date: 2015-06-03
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Publication No.: US09966166B2Publication Date: 2018-05-08
- Inventor: Hirokazu Nakai
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Yokkaichi, Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie
- Agency: Reising Ethington, P.C.
- Priority: JP2014-128022 20140623
- International Application: PCT/JP2015/065992 WO 20150603
- International Announcement: WO2015/198811 WO 20151230
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H01B7/17 ; H01B7/00

Abstract:
An electric wire and a shielding member configured to electrically shield the electric wire by enclosing an outer circumference thereof. A core wire of the electric wire has a single-core portion which is formed by applying pressure to a portion of a conductor obtained by twisting a plurality of strands together to reduce their cross section. This causes the strands to be brought into intimate contact with each other and form a single body, and a stranded wire portion in which the strands remain in a twisted-together state with no pressure having been applied thereto. The shielding member has a first shielding portion enclosing a portion of the electric wire where the core wire constitutes the single-core portion, and a second shielding portion enclosing a portion of the electric wire where the core wire constitutes the stranded wire portion. The second shielding portion has higher flexibility than the first shielding portion.
Public/Granted literature
- US20170148546A1 SHIELDED CONDUCTION PATH Public/Granted day:2017-05-25
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