Invention Grant
- Patent Title: Wire grid device
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Application No.: US14914912Application Date: 2014-08-21
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Publication No.: US09964678B2Publication Date: 2018-05-08
- Inventor: Takehito Suzuki
- Applicant: IBARAKI UNIVERSITY , JAPAN SCIENCE AND TECHNOLOGY AGENCY
- Applicant Address: JP Mito JP Kawaguchi
- Assignee: IBARAKI UNIVERSITY,JAPAN SCIENCE AND TECHNOLOGY AGENCY
- Current Assignee: IBARAKI UNIVERSITY,JAPAN SCIENCE AND TECHNOLOGY AGENCY
- Current Assignee Address: JP Mito JP Kawaguchi
- Agency: Oliff PLC
- Priority: JP2013-179151 20130830
- International Application: PCT/JP2014/071866 WO 20140821
- International Announcement: WO2015/029868 WO 20150305
- Main IPC: G02B5/30
- IPC: G02B5/30 ; H01Q15/24 ; G02B7/00

Abstract:
Achieve an extinction ratio in the approximate 10−6 class for intensity transmittance in the terahertz band with one element. A wire grid device configured from layering a plurality of film substrates each formed from a rectangular polymer film wherein a narrow rectangular metal thin plate is formed in the approximate center of one face thereof. By having the width of the metal thin plate be approximately 1.0 mm, the length of the metal thin plate be approximately 12.0-30 mm, and the thickness of the film substrate be approximately 0.5-50 μm, it is possible to easily achieve an extinction ratio in the approximate 10−6 class for intensity transmittance in the terahertz band with one element.
Public/Granted literature
- US20160209567A1 WIRE GRID DEVICE Public/Granted day:2016-07-21
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