Invention Grant
- Patent Title: Temperature sensor
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Application No.: US14389089Application Date: 2013-03-26
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Publication No.: US09964451B2Publication Date: 2018-05-08
- Inventor: Hiroshi Tanaka , Hitoshi Inaba , Kazuta Takeshima , Noriaki Nagatomo
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2012-081109 20120330
- International Application: PCT/JP2013/060137 WO 20130326
- International Announcement: WO2013/147310 WO 20131003
- Main IPC: G01K7/00
- IPC: G01K7/00 ; G01K7/22 ; H01C7/04 ; H01C7/00

Abstract:
Provided is a temperature sensor which does not easily cause a crack in a Ti—Al—N-based thermistor material layer when the film is bent, can be directly deposited on a film or the like without firing, and has a high reliability with a high heat resistance. The temperature sensor includes an insulating film 2, a thin film thermistor portion 3 made of a Ti—Al—N-based thermistor material formed on the insulating film, a pair of pattern electrodes 4 formed on the insulating film with a pair of opposed electrode portions 4a being arranged so as to be opposed to each other on the thin film thermistor portion, wherein the pair of opposed electrode portions covers the entire surface of thin film thermistor portion excluding the region between the opposed electrode portions.
Public/Granted literature
- US20150085898A1 TEMPERATURE SENSOR Public/Granted day:2015-03-26
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