A substrate working machine that performs mounting work on a circuit substrate is provided. The machine includes a receiving section that receives a first mounting work-correspondence device and a mounting stand on which a second mounting work-correspondence device is detachably mounted. The mounting work-correspondence device includes at least one of a device supplying an item necessary for the mounting work, a device discharging an item unnecessary in the mounting work, and a device performing processing required for the mounting work. The receiving section and the mounting stand are disposed at a predetermined edge portion of a base.