Invention Grant
- Patent Title: Polishing apparatus and semiconductor manufacturing method
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Application No.: US15008570Application Date: 2016-01-28
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Publication No.: US09960071B2Publication Date: 2018-05-01
- Inventor: Takayuki Nakayama , Masayoshi Adachi
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-144298 20150721
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; B24B37/24 ; H01L21/3105 ; B24B37/32
Abstract:
A polishing apparatus according to an embodiment includes a first polishing part, a second polishing part, and an annular part. The second polishing part includes a mounting surface for a semiconductor substrate, and rubs the semiconductor substrate mounted on the mounting surface while pressing the semiconductor substrate against the first polishing part. The annular part includes a support part provided in the second polishing part, and a plurality of convex portions that project from the support part toward the first polishing part, are arranged in a circumferential direction around the mounting surface while being supported by the support part, and are movable in a radial direction of the semiconductor substrate.
Public/Granted literature
- US20170025283A1 POLISHING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD Public/Granted day:2017-01-26
Information query
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