Invention Grant
- Patent Title: Wiring board and mounting structure using the same
-
Application No.: US15028998Application Date: 2014-10-29
-
Publication No.: US09936583B2Publication Date: 2018-04-03
- Inventor: Katsura Hayashi
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2013-225359 20131030
- International Application: PCT/JP2014/078770 WO 20141029
- International Announcement: WO2015/064642 WO 20150507
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/00 ; H05K3/46 ; H01L21/48 ; H01L23/538 ; H01L23/00 ; H05K1/02 ; H05K1/11
Abstract:
A wiring board is provided which includes an insulating layer; and a frame body disposed on the insulating layer. The frame body is provided with a through-hole. The insulating layer has a concave portion in one main surface on a frame body side. In a plan view of the wiring board, the concave portion has a first portion positioned at the through-hole, and a second portion which is positioned at the frame body and is continuous with the first portion. An air gap is formed between the frame body and the insulating layer in the second portion.
Public/Granted literature
- US20160278214A1 WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME Public/Granted day:2016-09-22
Information query
