Invention Grant
- Patent Title: Semiconductor package and manufacturing method thereof
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Application No.: US15149144Application Date: 2016-05-08
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Publication No.: US09935083B2Publication Date: 2018-04-03
- Inventor: Jae Ung Lee , Yung Woo Lee , Mi Kyeong Choi , Jin Seong Kim
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2015-0159058 20151112
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L25/065 ; H01L25/00
Abstract:
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
Public/Granted literature
- US20170141081A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-05-18
Information query
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