Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
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Application No.: US15128126Application Date: 2015-03-23
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Publication No.: US09935074B2Publication Date: 2018-04-03
- Inventor: Syoichirou Oomae , Akira Iwabuchi
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2014-64193 20140326
- International Application: PCT/JP2015/001622 WO 20150323
- International Announcement: WO2015/146130 WO 20151001
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L23/00 ; H01L21/48 ; H01L21/56 ; H02M7/537 ; H02P27/08
Abstract:
A lead frame has a first sink, an island, and a control terminal. The lead frame is bent, and at a rear surface, the island is positioned closer to one surface of a resin molded body than the first sink and a passive component mounting portion of the control terminal. A passive component is mounted on the passive component mounting portion of the control terminal through a bonding material, the passive component mounting portion being a part of one surface.
Public/Granted literature
- US20170103962A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2017-04-13
Information query
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