Invention Grant
- Patent Title: Techniques for filling a structure using selective surface modification
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Application No.: US15347948Application Date: 2016-11-10
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Publication No.: US09935005B2Publication Date: 2018-04-03
- Inventor: Kurtis Leschkies , Steven Verhaverbeke
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L29/06 ; H01L21/30 ; H01L21/768 ; C23C16/455 ; C23C16/48 ; C23C16/50 ; C23C16/52 ; C23C16/56 ; H01L21/67 ; C23C16/02 ; C23C16/04
Abstract:
A method of device processing. The method may include providing a cavity in a layer, directing energetic flux to a bottom surface of the cavity, performing an exposure of the cavity to a moisture-containing ambient, and introducing a fill material in the cavity using an atomic layer deposition (ALD) process, wherein the fill material is selectively deposited on the bottom surface of the cavity with respect to a sidewall of the cavity.
Public/Granted literature
- US20170140983A1 TECHNIQUES FOR FILLING A STRUCTURE USING SELECTIVE SURFACE MODIFICATION Public/Granted day:2017-05-18
Information query
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