Invention Grant
- Patent Title: Copper paste composition and its use in a method for forming copper conductors on substrates
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Application No.: US14960814Application Date: 2015-12-07
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Publication No.: US09934880B2Publication Date: 2018-04-03
- Inventor: Marc Henry Labranche
- Applicant: E I DU PONT DE NEMOURS AND COMPANY
- Applicant Address: US DE Wilmington
- Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee Address: US DE Wilmington
- Main IPC: H01B1/16
- IPC: H01B1/16 ; B05D5/12 ; H01B1/02 ; H01B1/22 ; H01B13/00
Abstract:
This invention relates to a copper thick film paste composition paste comprising copper powder, a Pb-free, Bi-free and Cd-free borosilicate glass frit, ruthenium-based powder, and an organic vehicle. The invention also provides methods of using the copper thick film paste composition to make a copper conductor on a substrate. Typical substrates are selected from the group consisting of aluminum nitride, aluminum oxide and silicon nitride.
Public/Granted literature
- US20160086682A1 COPPER PASTE COMPOSITION AND ITS USE IN A METHOD FOR FORMING COPPER CONDUCTORS ON SUBSTRATES Public/Granted day:2016-03-24
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