Invention Grant
- Patent Title: Short circuit reduction in an electronic component comprising a stack of layers arranged on a flexible substrate
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Application No.: US14128003Application Date: 2012-06-21
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Publication No.: US09934836B2Publication Date: 2018-04-03
- Inventor: Christer Karlsson , Olle Jonny Hagel , Jakob Nilsson , Per Bröms
- Applicant: Christer Karlsson , Olle Jonny Hagel , Jakob Nilsson , Per Bröms
- Applicant Address: NO Oslo
- Assignee: THIN FILM ELECTRONICS ASA
- Current Assignee: THIN FILM ELECTRONICS ASA
- Current Assignee Address: NO Oslo
- Agency: Moore & Van Allen PLLC
- Agent Michael G. Johnston
- Priority: SE1150594 20110627; WOPCT/EP2011/060740 20110627
- International Application: PCT/EP2012/062025 WO 20120621
- International Announcement: WO2013/000825 WO 20130103
- Main IPC: H05K1/00
- IPC: H05K1/00 ; G11C11/22 ; G11C13/00 ; H01L27/28 ; H01L51/05

Abstract:
An electronic component (1) and an electronic device (100) comprising one or more such components (1). The electronic component (1) comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one insulating or semi-insulating layer (7) between said electrodes. The stack further comprises a buffer layer (13), arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (ΔL) occurring in the protective layer (11) and thus preventing said dimensional change (ΔL) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.
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