Invention Grant
- Patent Title: Full bandwidth communication buses
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Application No.: US15059009Application Date: 2016-03-02
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Publication No.: US09934178B2Publication Date: 2018-04-03
- Inventor: Lior Amarilio , Boaz Moskovich , Michael Zilbershtein
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Withrow & Terranova, PLLC
- Main IPC: G06F13/36
- IPC: G06F13/36 ; G06F13/42 ; H04L12/911

Abstract:
Full bandwidth communication buses are disclosed. While primarily focused on the Serial Low-power Inter-chip Media Bus (SLIMbus) communication bus, the concepts of the present disclosure may be extended to other communication buses. Exemplary aspects of the present disclosure utilize a reserved segment distribution code and a segment length to define a Segment Interval that is better-sized relative to raw data bits. By fitting the segment interval to the size of the raw data bits, bandwidth utilization is maximized, resulting in faster effective data transfers. Completion of such efficient data transfers may allow the communication bus to spend more time in a low-power mode and thus, conserve power. Additionally, such efficient data transfers may allow for better quality in presentation of multimedia content to the user.
Public/Granted literature
- US20160259743A1 FULL BANDWIDTH COMMUNICATION BUSES Public/Granted day:2016-09-08
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