Invention Grant
- Patent Title: Low return loss silicon photonics package structure
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Application No.: US15417342Application Date: 2017-01-27
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Publication No.: US09933585B2Publication Date: 2018-04-03
- Inventor: Ning Zhang , Tuo Shi , Yongbo Shao , Tzung-I Su , Dong Pan
- Applicant: SiFotonics Technologies Co., Ltd.
- Applicant Address: KY Grand Cayman
- Assignee: SIFOTONICS TECHNOLOGIES CO., LTD.
- Current Assignee: SIFOTONICS TECHNOLOGIES CO., LTD.
- Current Assignee Address: KY Grand Cayman
- Agency: Han IP Corporated
- Priority: CN2016100698652 20160201
- Main IPC: G02B6/42
- IPC: G02B6/42 ; G02B6/27 ; G02B6/30 ; H01S5/022 ; H01S5/00 ; H01S5/12

Abstract:
A compact and highly efficient coupling structure for coupling between DFB-LD and Si PIC edge coupler with suppressed return loss may include a DFB-LD, a Si PIC comprising at least one input edge coupler and at least one output edge coupler, a silica cover lid disposed on the Si PIC and aligned edge to edge with the Si PIC, a single-mode fiber aligned to the at least one output edge coupler of the Si PIC, a lens disposed between the DFB-LD and the at least one input edge coupler of the Si PIC, and an isolator bonded to a facet of the at least one input edge coupler with a first volume of an index matching fluid. The lens may be configured to minimize a mismatch between an output spot size of the DFB-LD and a spot size of the at least one input edge coupler of the Si PIC.
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