A hot melt adhesive composition is provided which contains at least one silane group-containing thermoplastic poly-α-olefin which is solid at 25° C. and at least one paraffin wax. The hot melt adhesive composition has only low adhesion to uncoated aluminum tool surfaces, wherein at the same time they have high final strengths and thermal stabilities comparable to conventional adhesives, as well as good resistance to environmental influences. The hot melt adhesive is suitable as a laminating adhesive for laminating films made of thermoplastic olefins, which have sufficient stability for subsequent deep-draw lamination.