Invention Grant
- Patent Title: Wafer edge trimming tool using abrasive tape
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Application No.: US13836439Application Date: 2013-03-15
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Publication No.: US09931726B2Publication Date: 2018-04-03
- Inventor: Tang-Kuei Chang , Kuo-Hsiu Wei , Kei-Wei Chen , Huai-Tei Yang , Ying-Lang Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: B24B9/06
- IPC: B24B9/06 ; B24B21/00 ; B24B21/04
Abstract:
A wafer edge trimming tool includes an abrasive tape and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process.
Public/Granted literature
- US20140213152A1 Wafer Edge Trimming Tool Using Abrasive Tape Public/Granted day:2014-07-31
Information query
